Selection, modification and characterization of adhesives

Selection, modification and characterization of adhesives

Electrically conductive bond for signal transmission
© Fraunhofer IWS Dresden
Electrically conductive bond for signal transmission
Full polymer dielectric polymer actuator for characterization
© Fraunhofer IWS Dresden
Full polymer dielectric polymer actuator for characterization
Disperser for filler integration
© Fraunhofer IWS Dresden
Disperser for filler integration

A suitable adhesive system is chosen under consideration of the material matching, surface consistence, and the required performance of each adhesive bond. Depending on and in coordination with the customer’s requirements, both commercially available adhesives may be used and/or adhesive systems modified.

Nanoparticles, such as carbon nanotubes, nanohorns, graphenes, conductive carbon black and nanoferrites can be inserted into adhesives to produce bonded joints with additional functions like electrical conductivity.

The adhesive system can be subject to various analyses: mechanical characterization of adhesives, rheological analyses of the curing characteristics or the measurement of integrated additional functions. Adhesive modification is performed by means of the dual asymmetric centrifuge and the Ultra-Turrax® dispersing device.