Surface functionalization laboratories

Development of complete DLIP systems for industrial use.
© Fraunhofer IWS
Development of complete DLIP systems for industrial use.

Laser sources

  • Different ns- and ps- pulsed solid state laser systems (available wavelengths: 266, 355, 532 and 1064 nm), 0.5 to 300 W

Equipment technology

  • Laser interference structuring systems (in-house development), resolution up to 150 nm, 0.9 m²/min
  • CNC four-axis positioning systems (x, y, z, rotation), resolution: 0.5 µm, x/y/z scan length up to 500 mm, rotation angle: 360°.
  • Reflected light microscopes, max. magnification: 150x
  • Tribometer, force resolution: 0.1 µN
  • White light interferometers and confocal microscopes, vertical resolution: up to 0.1 nm, La-teral resolution: up to 140 nm
  • Roll to roll UV/Hot embossing system, film width up to 300 mm, up to 50 m/min (TU Dresden)
  • AI-Testbench – Predictive modeling for laser precision manufacturing: Combining micromaterial processing with artificial intelligence and machine learning.

Animation: KI Testbench

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© Fraunhofer IWS

Technical data KI-Testbench

  • One measurement and two machining platforms, connected by a precision axis system.
  • Processing stages: polygon scanner, flexible beam former, 3D scan system and DLIP module for laser interference texturing
  • Beam sources: high-power ultrashort pulse laser (P higher than 300 W, tp = 1.6 ps, Ep = 3 mJ) and a short-pulse fiber laser (P higher than 200 W, variable pulse duration and shape)