Technologies

Laser micromachining with its extensive possibilities for high-precision component manufacturing is used in many fields. The use of ultrashort pulse laser systems enables high-precision processing of any material, including transparent materials and thin layers, without undesirable thermal influence on the base material. Applications range from drilling the smallest nozzle holes to cutting any material with high precision or microstructuring to adapt surface properties and interface optimization in material composites. Microjoining of different material combinations by fine welding is also possible with the laser. Analytics using high-speed camera technology opens up in-depth insights into fast-running processes and complements our capabilities in process development.

High precision cutting of quartz glass wafers.
© Fraunhofer IWS
High precision cutting of quartz glass wafers.
Tailored, laser-generated reservoirs for lifetime lubrication in high-performance ceramic bearings.
© Fraunhofer IWS
Tailored, laser-generated reservoirs for lifetime lubrication in high-performance ceramic bearings.

Laser Micro Cutting

  • Plastic films (e. g. PDMS, PS, PLA) for the production of microfluidics for lab-on-a-chip systems
  • Teflon impression masters for imprint technology and microfluidic applications
  • Temperature-sensitive solder foils and reactive multilayers for joining applications
  • Material composites, e. g. enameled metallic components for the watch industry, electrode material from battery technology or fiber composites for lightweight construction applications
  • Semiconductor and wide-bandgap semiconductor wafers for electronic industry
     

Laser Micro Drilling

  • Nozzle configurations
  • Apertures for optical and analytical applications
  • Electrical vias in ceramic and semiconductor substrates
  • Drilling and perforating of plastic foils for microfluidic applications
     

Laser Structuring

  • Customized surface structures increase joint strength, e. g. for hybrid material combinations based on fiber-reinforced plastics in combination with processes such as thermal spraying, plastic injection molding, laser direct joining or adhesive bonding. More information at: Technologies for modern lightweight construction
  • Surface structuring, e. g. optimization of production of structures for guiding cell growth and textured surfaces to improve the performance of battery cells and fuel cells
  • Shaping by material removal for the production of molding and cutting tools made of hard materials such as ceramics or hard metals
Investigations into the cleaning of historical, fire-damaged enamel dials.
© Fraunhofer IWS
Investigations into the cleaning of historical, fire-damaged enamel dials.
Decorative, selective ablation of carbon layer with smallest details of approx. 20 µm (Lange Uhren GmbH)
© A. Lange & Söhne
Decorative, selective ablation of carbon layer with smallest details of approx. 20 µm (Lange Uhren GmbH)

Laser Decoating and Cleaning

  • Separation of thin film systems in the "scribe process" for thin film electronics and thin film photovoltaics 
  • Local, selective decoating of components for joint preparation during welding and bonding or in case of defective coatings
  • Laser micromarking of components
  • Laser cleaning for technical and restoration applications
    • Technical laser cleaning: More information at: Fraunhofer-Business Area Cleaning
    • Restorative laser cleaning of art and cultural objects
      • Laser-based cleaning of art and cultural objects made of wood, metal, stone, polymers, textiles, material composites, etc.
      • Selective removal of patina, environmental and use-related contamination
      • Enhanced competences for the preservation of cultural heritage through cooperation in the FALKE - Research Alliance Cultural Heritage
  • Decorative design by ablation of transparent, blue carbon layers on components of high-quality mechanical watches

Laser Functionalization and Modification

  • Generation of functional groups by laser irradiation under reactive gas atmosphere
  • Excitation of polymerization of monomers
     

High-speed Camera Technology

  • Process analysis on highly dynamic processes such as remote laser cutting, rapid prototyping and laser welding