Fraunhofer IWS has built EDcut as a ready-to-use system for research and development. The platform utilizes a solid-state laser with beam deflection via a galvanometer scanner, focusing optics, and a dynamically movable gas nozzle for fusion cutting. This makes the system especially suitable for metals and composites with small material thicknesses.

The currently realized working area measures 50 millimeters in length and width. For larger components, the system can be coupled with additional motion axes. Integration into roll-to-roll systems is also foreseen. EDcut thus opens new design possibilities for automated cutting with high feed rates and changing geometries.

Industrial Applications in Focus

EDcut targets companies that want to implement flexibly configurable cutting processes in production or expand existing systems. Applications range from notching technical foils to cutting delicate structures in metal strips to processing bipolar plates for hydrogen systems. “In variant production with frequent geometry changes or novel materials, laser cutting holds a technological edge,” said Dr. Jan Hauptmann, head of the Ablation and Separation department at Fraunhofer IWS. “Our platform aims to make this advantage accessible for industrial partners.”

Possible cooperation models include process studies, prototype manufacturing, and integration of system technology into existing production lines. “EDcut allows us to develop new cutting processes quickly and close to practice,” emphasized Dr. Hauptmann. “This lowers barriers in early technology development and accelerates implementation for customers.” The open architecture also enables combinations with market-available components, for example, for path guidance or control.

Combination of Process and System Competence

A key added value lies in the close interlinking of technology and system development. Alongside application technology, Fraunhofer IWS contributes expertise in optical design, beam guidance, and control. Specific components, particularly optical assemblies, are developed in-house and tailored to the requirements of highly dynamic laser cutting.

“We combine in this system our entire experience in cutting process development with the competence to design customized system solutions,” said Dr. Hauptmann. “That makes us a development partner, not a supplier of a finished product.” At the same time, the platform serves as a testbed for future applications. In addition to thin-sheet processing, the ongoing development of laser cutting focuses on new approaches to dynamic beam shaping. Initial material samples indicate that suitable modulation can significantly improve cut quality and speed in thick-sheet cutting.