Electrical Engineering and Microelectronics

"Silicon Saxony" is a term with international impact – and it stands for Europe's largest location for microelectronics, whose heart beats in Dresden. Microelectronics is one of the key technologies in the digital age and semiconductors are the basis for all digital applications. It is also impossible to imagine our lives without modern electrical engineering. Miniaturization, high-performance and stable conductor paths with simultaneously high thermal conductivity are only exemplary challenges that the market presents to companies.

In the electrical engineering and microelectronics sectors we offer expertise built up over many years wherever state-of-the-art laser, materials and beam technology is required. Our competencies range from research and development of high-performance coatings in EUV lithography to automation and control technology and electronics. Our solutions are used, for example, when it comes to OLED and semiconductor technologies, in wafer production or in electrical power engineering.

Our Services for Electrical Engineering and Microelectronics

Learn more about our latest research and development services. Do you have any questions about our comprehensive portfolio? Our contact partners will be happy to answer them. They will help to identify, evaluate and take advantages of opportunities.


Press release / 14.3.2023

Sharp Hyperspectral Eye for Chip Production

“DIVE imaging systems” Spins off from Fraunhofer IWS in Dresden


Press release / 2.3.2023

A New Generation of Instruments for Gas Permeation Measurement

“SimPerm” Project Enables Simultaneous Determination of Oxygen and Water Vapor Permeation Rates for the First Time


News / 12.4.2022

High-precision reactive joining technology for microsystems engineering

Fast, gentle and strong connections


News / 20.5.2021

Bonds against electrostatic discharges

Kunststoff-Zentrum (SKZ) and Fraunhofer IWS develop flexible electrically conductive adhesives and potting compounds


Press release / 16.3.2021

Hyperspectral vision speeds up barrier foil inspection

Quickly measure foil quality for organic electronics with high spatial resolution


News / 24.11.2020

EUV lithography opened the door to digital age

Review on the award of the German Future Prize 2020 (Deutscher Zukunftspreis 2020) to Trumpf, Zeiss and Fraunhofer