Laser Cutting

High-speed laser cutting of a complex contour.
© Fraunhofer IWS
High-speed laser cutting of a complex contour.

The laser cutting working group is primarily concerned with optimizing the laser cutting process in terms of quantity and quality. The tool is the continuous expansion of the own process understanding for special process variants and new cutting applications. Beyond the classical process variants, solutions for niche applications are developed. For this purpose, unique analysis possibilities in flexible experimental setups, access to a wide range of components of laser system technology, as well as in-house cooperation with the process design and analysis group are available. We are your contact for questions that cannot be answered with standard systems and processes. As a development partner, we support system providers and end users with our competencies on the way from the solution idea to series introduction.
 

Our Range of Services Includes:

  • Highly dynamic and low-damage laser cutting of electrical steel strip
  • Process development for cutting metals with a material thickness of 0.05 mm and more
  • Process development for cutting non-metals and composites
  • Qualification of new processes for production integration
  • Basic experimental investigations to deepen process understanding including simulation and design
 

Processes

 

System Development

 

Equipment

Event Note

 

Dresden / March 13–14, 2024

Laser Process Monitoring – Offline, Inline, Online

Lunch-to-Lunch-Workshop

Highlights and Scientific Expertise

 

Annual Report Article

Dynamic Beam Shaping for Optimized Laser Cutting

 

Video

High Dynamic Laser Fusion Cutting

 

Publications

Get an insight into the current publications of Fraunhofer IWS on laser cutting.

Projects

CLEANUkraine

Rebuilding Ukraine – Resilient und Sustainable, Timeframe01/2024–12/2024 (Fraunhofer)

Underwater Laser

Laser material processing for underwater applications, Timeframe01/2023–12/2023 (Fraunhofer)

HP2BPP

High-rate joining of bipolar plates from two half plates, Timeframe: 05/2022–11/2025 (BMDV, National Action Plan Fuel Cell Production (H2GO) FKZ: 03B11027A)

FastShape

Dynamic beam modulation for the optimization of industrial laser processes, Timeframe: 10/2019–12/2022 (Fraunhofer DFG cooperation program)

CBC-GREEN

Development of an efficient, novel beam source for laser materials processing of copper, Timeframe: 07/2021–06/2024 (First joint EUREKA and Photonics21 Mirror Group Call)

AI-BEAM

AI-assisted laser material processing using fast compact piezo-driven 3D beam shaping and new laser sources, Timeframe: 07/2022–06/2025 (Fraunhofer)

News and Media

 

Press Release / 30.8.2023

Laser Cutting Under Water

Fraunhofer IWS Seeks New Solution to Process Metals Even Below the Sea Surface

 

Press release / 21.9.2022

Sandblasting with Light

Fraunhofer IWS developed a laser technology to clean and structure surfaces particularly quickly while protecting the environment.