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Researchers at Fraunhofer IWS have developed a new laser-based technology called Laser Direct Plating that produces metallic layers faster, more energy-efficiently and at lower cost than established processes. The team helically wraps strip-shaped metal around rotationally symmetric components and locally creates a metallurgical bond to the substrate using laser energy. The base material remains solid, the surface stays smooth and requires little to no post-processing. Users significantly reduce cycle times, energy consumption and process costs.

A new measurement technology reduces scrap in fiber‑reinforced plastic (FRP) profiles and enables cost‑effective, real-time process control for small and medium-sized enterprises. Researchers developed the system in the PulLoop project led by the Fraunhofer Application Center for Optical Metrology and Surface Technologies AZOM. Together with Fraunhofer IGCV, the team developed an integrated measurement system that monitors product quality in real time during production and feeds the results back into the manufacturing process.

Friction determines energy consumption, wear, and the service life of technical systems. Within the BioSlide research project, the Fraunhofer Institute for Material and Beam Technology IWS investigates how sliding systems can be designed to be more sustainable and energy-efficient. Funded by the Federal Ministry of Research, Technology, and Space (BMFTR) under the “BioKreativ 4” program with around 3.3 million euros, the project establishes a new interdisciplinary junior research group. The group focuses on biobased materials, lubricants, and superlubricity.

Paper packaging offers a number of advantages over its plastic counterparts: It has a high recycling rate, lower CO₂ emissions, and lower disposal costs. However, it cannot yet be sealed without adhesives or layers of plastic – a disadvantage for manufacturing and recycling processes. In the PAPURE project, four Fraunhofer institutes are developing a laser-based process that enables completely adhesive-free paper packaging.