10th International Summer School

August 23–26, 2021, Online Workshop

DLIP workstation developed at TU Dresden for processing 2D- and 3D-parts.
© Fraunhofer IWS
DLIP workstation developed at TU Dresden for processing 2D- and 3D-parts.
SEM image showing exemplary DLIP pattern.
© Fraunhofer IWS
SEM image showing exemplary DLIP pattern.

The Technische Universität Dresden and the Fraunhofer Institute for Material and Beam Technology (IWS) are organizing the tenth International Summer School “Trends and new developments in Laser Technology“ from 23 to 26 August 2021. This four days workshop aims to bring together undergraduate and PhD students in an intensive study program on fundamental and applied aspects of laser technology.

The Summer School program consists of lectures by renowned experts and informal discussion sessions, as well as practical in­sights. The program also offers participants the opportunity to present their own research topics and aims to facilitate the ex­change of new ideas in these areas.


  • Surface hardening technologies
  • High speed 2D laser cutting
  • Laser welding
  • Additive manufacturing processes
  • Applications of ultra short pulsed lasers
  • Laser process simulation
  • Laser micro/nano structuring
  • Laser interference patterning

The programme will include:

  • Participant presentations (15 minutes)
  • Proceeding book with extended abstracts





Center for Advanced Micro-Photonics (CAMP)

CAMP explores laser-based surface modification and patterning methods. Driven by current trends in laser-based micro processing, the Center targets opportunities and challenges in the development of new system, process and measurement solutions.  


Chair of Large Area Laser Based Surface Structuring

LMO focuses on the development of technologies for the high speed functionalization of technical surfaces. To achieve this objective, we try to find the relationships between surface morphology with specific surface properties. The complex topographies that are required are produced either by laser based technologies or roll to roll imprinting and hot embossing methods.