Products and Applications

Fraunhofer IWS develops systems and compact processing heads for direct laser interference patterning (DLIP), which are adapted to individual customer’s specifications in order to enable a quick and accurate fabrication of arrays with micro- and sub-micrometer sized structures on large areas. Different lasers can be integrated into the DLIP-system which makes high process speeds, flexible structure geometries and/or processing of 3D-parts possible.

At Fraunhofer IWS, various surfaces like metals and polymers are structured in a micro- and sub-micrometer range by direct laser interference patterning (DLIP). One aim of the procedure is amongst others, the fabrication of decorative elements for individualization and the protection of products.

To improve the efficiency, innovative, periodically organized surface structures are produced on the transparent, conductive layer or on the polymer substrate of organic solar cells and OLEDs in an industrial applicable, scalable process.

To improve the efficiency of endoprostheses such as dental implants , artificial hip or knee joints, they are functionalized with micro and sub micrometer structures by direct laser interference patterning at Fraunhofer IWS.

With applying laser based technologies it is possible to imitate structure and function of natural surfaces. With laser interference lithography (LIL), Fraunhofer IWS succeeded in mimicking hierarchic structures and their bacteria-reducing effect at artificial photoresist surfaces.

With periodic micro structures, produced via Direct Laser Interference Patterning (DLIP), the adhesion factor of tetraedic-amorphous carbon (ta-C) layers was reduced by 83 % compared to the tribo system steel/steel and 20 % compared to the system ta-C/ta-C.