Coating equipment

The spin-coating technology allows us to apply homogeneous and defect free liquid films to the substrate by rotation spinning of the liquid. The spin-coater can be used for coatings, cleaning of substrates or etching. Usable liquids are any kind of solvents, basic or acid solutions or dispersions.

Equipment

• model: WS-650Mz-8NPP-Lite Single Wafer Spin Processor (Laurell Technologies Corp.)
• size of process chamber: Ø 318 mm
• size of substrate: up to Ø 200 mm, 178 mm x 178 mm, depth 0,1 - 1 mm
• velocity: 100 - 1200 RPM

With this ultrasonic spray unit it is possible to homogeneously apply large area layer systems to substrates using pyrolysis or wet spraying. Pyrolysis requires a sufficiently high substrate temperature for the precursor solution so that all components are able to pass into a gaseous state. The layer precipitates onto the substrate through a chemical vapor reaction. After the process of wet spraying the layer material and furthermore a solvent film remains on the substrate. The solvent evaporates when heated afterwards.

Our activities in this field include large area spraying of oxide-ceramics (e.g. aluminum-oxide as passivation layer for photovoltaics) and semiconductors (e.g. ZnO:Al) and spraying of dispersions, for example made of CNTs for manufacturing of transparent conductive layers.

Equipment

• ultrasonic nozzles (Sono Tek Corp.):
• 120 kHz, Vortex, drop size 19 µm diameter for water
  precursor flow rate: up to 1.5 ml/min, circular spray pattern
• 120 kHz, surface nozzle
  precursor flow rate: 10 ml/min - 70 ml/min, spray width: 5 - 60 cm

• max. substrate size: up to 156 mm x 156 mm
• max. substrate temperature: 450 °C
• distance nozzle - substrate: up to 200 mm
• atmosphere: air or nitrogen
• movement system for nozzle: nozzle movable in x- and y-direction with max. 200 mm/s