“DIVE imaging systems” Spins off from Fraunhofer IWS in Dresden

Sharp Hyperspectral Eye for Chip Production

Press release (No. 03) - Fraunhofer IWS Dresden /

Precise two-dimensional analysis of high-tech layers in microelectronics, battery factories or even in the automotive sector approaches within reach. A measuring system developed at the Fraunhofer Institute for Material and Beam Technology IWS facilitates this by integrating hyperspectral sensor technology, artificial intelligence and special illumination techniques into a high-performance, highly flexible inspection system. A team of researchers from Fraunhofer IWS establishes “DIVE imaging systems GmbH”, a BMWK-funded spin-off company, to commercialize this promising technology.