Sputtering

Sputtering

Sputterquelle in Aktion
© Fraunhofer IWS Dresden
Sputterquelle in Aktion
Sputtertarget
© Fraunhofer IWS Dresden
Sputtertarget
Principle of the sputtering process
© Fraunhofer IWS Dresden
Principle of the sputtering process

The sputtering technology is one of the most common PVD technologies.
It is used for various applications - from large-area coatings (e.g. window glass) to coatings in microelectronics. The sputtering technology is available at the IWS – e.g. for the deposition of metal layers.


Principle of sputtering

Argon ions are generated by a magnetic field-assisted glow discharge in argon atmosphere. Due to the negative electrical bias on the target they hit on the target with high energy. Due to this process, atoms of the target material will be removed from the surface and can be used for coating substrates.


Characteristics

  • Pressure: 0.1 Pa
  • Voltage: 500 V
  • Energy flux density factor at the target: 10 W / cm 2
  • Deposition rate: 10 nm / s