Chemical vapor deposition at atmospheric pressure (AP-CVD)
AP-CVD can deposit functional thin films at low process temperatures onto nearly all materials. Low-cost liquid or gaseous precursors are transferred to the surfaces via the vapor phase. The vapor can be activated by plasma or reactions in the vapor phase (water, ozone). Typical coating thicknesses range from 10 to 1000 nm. IWS AP-CVD coating systems can be adapted to efficient in-line processes. We offer sample coatings of up to 300 by 300 mm2 for feasibility studies.
A pilot band coating machine is available at the IWS to coat electrode materials. On a small laboratory scale IWS engineers use tabletop squeegees to develop suspensions. The pilot coating machine can be used to apply the suspensions in a continuous process. Solvents are removed in a drying line, which consists of three independent heating zones. The wet film deposition is performed via a roll at a speed of up to 6 m/min. Foils can be coated up to a width of 30 cm. Flammable solvents such as NMP can be used as well. After the deposition coatings are compacted and smoothened using a 250 kN calendar.
Thin films can also be deposited on surfaces from dispersions or solutions. IWS engineers use spray (ultrasonic and airbrush) and dip processes for this purpose. Substrates of up to 300 by 300 mm2 can be homogeneously coated. Various metal oxide thin films can be fabricated using sol-gel precursors, nano particle dispersions or metal salt solutions. Such processes are used to produce barrier coatings, nonstick surfaces or antistatic properties on a variety of substrate materials.